Ukutyhila iNkqubo yeMveliso ye-Industrial-Grade TFT Color Screens

Kwiinkalo ezifunwa kakhulu ezifana ne-industrial automation, izixhobo zonyango, kunye nokuthuthwa okuhlakaniphile, ukuzinza kunye nokuthembeka kwezikrini zokubonisa i-TFT zichaphazela ngokuthe ngqo ukusebenza ngokubanzi kwezixhobo. Njengenxalenye ephambili yokubonisa izixhobo zemizi-mveliso, izikrini zemibala ye-TFT ye-industrial-grade ziye zaba lolona khetho lukhethwayo kwiindawo ezininzi ezinzima ngenxa yesisombululo sabo esiphezulu, ukuguquguquka kobushushu obubanzi, kunye nobomi obude. Ke, iveliswa njani isikrini sombala we-TFT esikumgangatho ophezulu weshishini? Zeziphi iindlela ezingundoqo kunye nezibonelelo zetekhnoloji ezilele emva kwezikrini zemibala ye-TFT?

Inkqubo yokuvelisa izikrini zemibala ye-TFT ye-industrial-grade idibanisa ukuveliswa ngokuchanekileyo kunye nokulawulwa komgangatho ongqongqo, apho inyathelo ngalinye lichaphazela ngokuthe ngqo ukusebenza kunye nokuthembeka kwesikrini se-TFT. Apha ngezantsi ngundoqo wokuhamba komsebenzi:

1. Ukulungiswa kweSubstrate yeglasi
   Iglasi ecocekileyo ye-alkali-engenawo isetyenziselwa ukuqinisekisa ukusebenza kakuhle kwe-optical kunye nokuzinza kwe-thermal, ukubeka isiseko sokwenziwa kwe-TFT yesekethe elandelayo.
2. Thin-Film Transistor (TFT) Array Manufacturing
   Ngeenkqubo ezichanekileyo ezifana ne-sputtering, i-photolithography, kunye ne-etching, i-matrix ye-TFT yenziwa kwi-substrate yeglasi. I-transistor nganye ihambelana ne-pixel, eyenza ulawulo oluchanekileyo lwemo ye-TFT yokubonisa.
3. Imveliso yesihluzi soMbala
   Izaleko zesihluzi sombala we-RGB zigqunywe kwenye i-substrate yeglasi, ilandelwa kukusetyenziswa kwe-matrix emnyama (BM) ukukhulisa umahluko kunye nokusulungeka kombala, ukuqinisekisa imifanekiso edlamkileyo nefana nobomi.
4. ILiquid Crystal Injection kunye ne-Ecapsulation
   Ii-substrates ezimbini zeglasi zilungelelaniswe ngokuchanekileyo kwaye zidityaniswe kwindawo engenathuli, kunye nezinto zekristale ezingamanzi zitofwa ukuthintela ukungcola ekuchaphazeni umgangatho wokuboniswa kwe-TFT.
5. Qhuba IC kunye PCB Bonding
   I-chip yomqhubi kunye ne-flexible printed circuit (FPC) ixhunyiwe kwiphaneli ukwenzela ukuba igalelo lombane lombane kunye nokulawula umfanekiso ochanekileyo.
6. INdibano yeModyuli kunye noVavanyo
   Emva kokudibanisa amacandelo afana ne-backlight, i-casing, kunye ne-interfaces, iimvavanyo ezibanzi zenziwa ngokukhanya, ixesha lokuphendula, ii-angles zokubukela, ukufana kombala, kunye nokunye ukuqinisekisa ukuba isikrini sombala we-TFT ngasinye sidibana nemigangatho yemigangatho ye-industrial.